BGA and Solder Joint Analysis
XVOIDPRO Automatic AI-based Electronic Component Analysis Software with Report Generator
The latest version of XVOIDPRO for solder joint analysis of electronic components now also enables the automatic detection of solder joints and BGA balls and their evaluation. This makes the semi or fully automatic evaluation of assembled circuit boards much more efficient. The XVOIDPRO analysis software uses AI (artificial intelligence) for solder joint analysis and determination of solder joints and balls. The big advantage of artificial intelligence is that the software recognizes additional features through training data sets.
Fully Automated BGA Inspection
BGA balls are recognized fully automatically, the shape of the ball is evaluated and the gas content is determined
A freely definable threshold value can be entered for the percentage gas content or the values from the IPC standard can be selected.